MLINK is a wireless communication chip development company.
| Announced Date | Round | Money Raised | Number of Investors | Lead Investors | Post Valuation | |
|---|---|---|---|---|---|---|
| Jan 23, 2018 | Series D | ¥15M | 1 |
Landstone Capital
|
— | Detail |
| Jun 5, 2017 | Series C | ¥30M | 1 | — | — | Detail |
| Sep 9, 2015 | Series B | ¥20M | 1 |
|
— | Detail |
| Jan 17, 2014 | Angel | ¥3M | 1 | — | — | Detail |
| Investor Name | Lead Investor | Funding Round |
|---|---|---|
Landstone Capital
|
Yes | Series D |
|
|
Yes | Series B |
|
|
— | Series C |
Huiyao Ziben
|
— | Angel |