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Microbonds
company
About
Microbonds develops insulated bonding wire technology for the semiconductor packaging and microchip industries.
- 11 - 50
Details
- Last Funding Type
- Grant
- Last Funding Money Raised
- $334K
- Industries
- Industrial,Manufacturing,Semiconductor
- Founded date
- Jan 1, 1999
- Number Of Employee
- 11 - 50
- Operating Status
- Active
Microbonds is a pioneer and leader in the research, development and application of gold and copper insulated bonding wire technology for the semiconductor packaging and microchip industries. Microbonds' proprietary chemistry invention is a key to this breakthrough that is poised to sustain and extend an existing US$20B+ wire bond infrastructure and US $4B+ consumables marketplace. Microbonds technology is proven on coated gold bonding wire and is well positioned to capitalize on the growing market demand for coated copper bonding wires.
Funding Rounds
Number of Funding Rounds
Total Funding Amount
1
$334K
Microbonds has raised a total of
$334K
in funding over 2 rounds. Their latest funding was raised on
Apr 14, 2022 from a Grant round.
| Announced Date | Round | Money Raised | Number of Investors | Lead Investors | Post Valuation | |
|---|---|---|---|---|---|---|
| Apr 14, 2022 | Grant | $334K | 1 |
|
— | Detail |
Investors
Number of Lead Investors
Number of Investors
1
1
Microbonds is funded by 1 investors.
Ontario Together Fund
are the most recent investors.
| Investor Name | Lead Investor | Funding Round |
|---|---|---|
|
|
Yes | Grant |
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